European Microelectronics and Packaging Symposium
نویسنده
چکیده
An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expose sidewalls of grooves and slots in the substrate. In this paper the newest advances of using the 3-D patterning technique for MCM-D are presented. Using a dedicated test module as technology carrier the 3-D patterning technique has been implemented in a full fabrication technology, showing the compatibility of diffractive lithography with fine line substrate fabrication and advanced fine pitch assembly. Other applications that have been successfully explored with the 3-D patterning technique are toroidal inductive components and quadruple leads in a single through-wafer hole.
منابع مشابه
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis
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